LOCTITE® ABLESTIK 84-1LMI
Známe ako ABLEBOND 84-1LMI
Vlastnosti a výhody
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Aplikácia | Pripevnenie formy |
| Fyzikálna forma | Pasta |
| Objemový odpor | 0.0005 Ohm cm |
| Pevnosť v strihu, Hliník | 1500.0 psi |
| Plán vytvrdnutia, @ 150.0 °C | 1.0 hod. |
| Počet zložiek | 1 zložka |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Teplota skladovania | -40.0 °C |
| Tixotropný index | 4.0 |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.