LOCTITE® ABLESTIK 84-1LMI
U svojstvu ABLEBOND 84-1LMI
Značajke i prednosti
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
Dodatne informacije
Dokumenti i preuzimanja
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Tehnički podaci
| Broj komponenti | 1 dio |
| Fizički oblik | Pasta |
| Otpornost volumena | 0.0005 Ohm cm |
| Primjene | Ukalupljeno |
| Skladišna temperatura | -40.0 °C |
| Snaga smicanja, Aluminij | 1500.0 psi |
| Tiksotropni indeks | 4.0 |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
| Zakaži stvrdnjavanje, @ 150.0 °C | 1.0 h |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.