LOCTITE® ABLESTIK 84-1LMI
다른 명칭: ABLEBOND 84-1LMI
특징 및 이점
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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기술 정보
| 경화 방식 | 열경화 |
| 경화 시간, @ 150.0 °C | 1.0 시간 |
| 구성 | 1액형 |
| 물리적 형태 | 페이스트 (고점도) |
| 요변성 지수 | 4.0 |
| 저장 온도 | -40.0 °C |
| 적용 분야 | 다이 접착 |
| 전단 강도, 알류미늄 | 1500.0 psi |
| 점도, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
| 체적 저항률 | 0.0005 Ohm cm |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.