LOCTITE® ABLESTIK 84-1LMI
被称为 ABLEBOND 84-1LMI
功能与优点
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
了解更多
技术信息
| 体积电阻率 | 0.0005 Ohm cm |
| 储存温度 | -40.0 °C |
| 剪切强度, 铝 | 1500.0 psi |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 150.0 °C | 1.0 小时 |
| 外观形态 | 膏状 |
| 应用 | 芯片焊接 |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
| 组分数量 | 单组份 |
| 触变指数 | 4.0 |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.