LOCTITE® ABLESTIK 84-1LMI
Tuntud kui ABLEBOND 84-1LMI
Omadused ja eelised
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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Tehniline teave
| Füüsiline vorm | Pasta |
| Komponentide arv | 1-komponentne |
| Kõvenemisaeg, @ 150.0 °C | 1.0 tund |
| Mahu resistiivsus | 0.0005 Ohm cm |
| Nihkejõud, Alumiinium | 1500.0 psi |
| Rakendused | Stantskinnitus |
| Säilitustemperatuur | -40.0 °C |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 4.0 |
| Viskoossus, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.