LOCTITE® ABLESTIK 84-1LMI
Conocido como ABLEBOND 84-1LMI
Características y Ventajas
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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Información técnica
| Aplicaciones | Unión |
| Forma Física | Pasta |
| Número de Componentes | Monocomponente |
| Programa de curado, @ 150.0 °C | 1.0 h |
| Resistencia al corte, Aluminio | 1500.0 psi |
| Resistividad de volumen | 0.0005 Ohm cm |
| Temperatura de almacenaje | -40.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
| Índice tixotrópico | 4.0 |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.