LOCTITE® ABLESTIK 84-1LMI
Known as ABLEBOND 84-1LMI
Features and Benefits
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
- Electrically conductive
- Low bleed
- Low outgassing
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Cure schedule, @ 150.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Paste |
| Shear strength, Aluminum | 1500.0 psi |
| Storage temperature | -40.0 °C |
| Thixotropic index | 4.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa·s (cP) |
| Volume resistivity | 0.0005 Ohm cm |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.