LOCTITE® ABLESTIK 84-1LMI
Žinoma kaip ABLEBOND 84-1LMI
Savybės ir privalumai
A 1-part, die-attach electrically conductive adhesive specially designed for microelectronic chip-bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die-attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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Techniniai duomenys
| Fizinė forma | Pasta |
| Kietėjimo planas, @ 150.0 °C | 1.0 val. |
| Kietėjimo tipas | Kietėjimas veikiant šilumai |
| Klampumas, „Brookfield“ CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
| Komponentų skaičius | 1 komponentas |
| Laikymo temperatūra | -40.0 °C |
| Pritaikomumas | Lustų klijavimas |
| Tiksotropinis indeksas | 4.0 |
| Tūrio varža | 0.0005 Ohm cm |
| Šlyties stipris, Aliuminis | 1500.0 psi |
LOCTITE® ABLESTIK 84-1LMI
A 1-part, die-attach electrically conductive adhesive specially designed for microelectronic chip-bonding applications. Ideal for application by automatic dispenser or hand probe.