LOCTITE® ABLESTIK 84-1LMI
Bekannt als ABLEBOND 84-1LMI
Merkmale und Vorteile
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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Technische Informationen
| Anwendungen | Gesenk-Verbindung |
| Anzahl Komponenten | 1K |
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 150.0 °C | 1.0 h |
| Lagertemperatur | -40.0 °C |
| Physikalische Form | Paste |
| Scherfestigkeit, Aluminium | 1500.0 psi |
| Thixotropie Index | 4.0 |
| Viskosität, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
| Volumenwiderstand | 0.0005 Ohm cm |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.