LOCTITE® ABLESTIK 84-1LMI
Zināms kā ABLEBOND 84-1LMI
Iezīmes un ieguvumi
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
Apraksts
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Tehniskā informācija
| Bīdes izturība, Alumīnijs | 1500.0 psi |
| Fizikālā forma | Pasta |
| Komponentu skaits | 1 komponents |
| Pielietojumi | Spiedoga pievienošana |
| Sacietināšanas veids | Sacietināšana karsējot |
| Tiksotropiskais indekss | 4.0 |
| Tilpuma pretestība | 0.0005 Ohm cm |
| Uzglabāšanas temperatūra | -40.0 °C |
| Viskozitāte, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
| Ārstēšanas grafiks, @ 150.0 °C | 1.0 h |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.