LOCTITE® ABLESTIK 84-1LMI
被稱為 ABLEBOND 84-1LMI
功能與優點
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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技術資訊
| 儲存溫度 | -40.0 °C |
| 剪切強度, 鋁 | 1500.0 psi |
| 固化類型 | 熱固化 |
| 建議固化方式, @ 150.0 °C | 1.0 小時 |
| 應用 | 晶片焊接 |
| 物理形態 | 黏貼 |
| 粘度，Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
| 觸變指數 | 4.0 |
| 零組件數 | 1 組分 |
| 體積電阻率 | 0.0005 Ohm cm |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.