LOCTITE® ABLESTIK 84-1LMI
旧名称 ABLEBOND 84-1LMI
特長および利点
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
詳細はこちら
技術情報
| せん断強度, アルミニウム | 1500.0 psi |
| アプリケーション(用途) | ダイ接着剤 |
| チクソ性指数 | 4.0 |
| 体積抵抗率 | 0.0005 Ohm cm |
| 保存温度 | -40.0 °C |
| 外観 | ペースト |
| 形態 | 1液 |
| 硬化スケジュール, @ 150.0 °C | 1.0 時間 |
| 硬化タイプ | 熱硬化 |
| 粘度、ブルックフィールド CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 84-1LMI
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.