LOCTITE® ABLESTIK ABP 8037TI
Features and Benefits
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates.
- High thermal conductivity
- Excellent electrical conductivity
- Excellent adhesive strength
- Stable at high temperatures
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 62.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 10.0 ppm |
| Extractable ionic content, Potassium (K+) | 1.0 ppm |
| Extractable ionic content, Sodium (Na+) | 20.0 ppm |
| Hot die shear strength | 7.4 kg-f |
| RT die shear strength | 17.6 kg-f |
| Young's modulus, @ 250.0 | 1300.0 N/mm² (188549.0 psi ) |
LOCTITE® ABLESTIK ABP 8037TI
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive