Digitalization as Essential

‘Digitalization’ is a word used broadly these days. It describes everything from the way we order consumer products on electronic devices to our car-driving experience and the automated efficiency of smart factories. Indeed, digitalization has wide-ranging applications with far-reaching implications. Data-informed eCommerce, predictive AI, 5G and IoT all serve to drive cost optimization, resource conservation, ultra-personalization, and global connectivity, creating value for customers and consumers.

Digitizing operations, communications and customer experiences are vital to Henkel – so much so, in fact, that the company launched a new business unit, Henkel dx, to push the digital innovation envelope and leverage the power of data and analytics across company manufacturing operations, product development, consumer engagement tools and sustainability initiatives.

New Developments in Ultra-Fast EV Charging Move Closer to Fuel Pump Parity

Irvine, CA – Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The material, Loctite Eccobond UF 9000AG, enables advanced silicon (Si) node flip chip integration by providing robust interconnect protection and compatibility with high-volume manufacturing environments. While the company has well-established pre-applied paste and film underfill materials for leading-edge chip technologies, this development broadens Henkel’s post-applied capillary portfolio for flip chips with advanced node scaling. 

Loctite Eccobond UF 9000AG breaks past conventional formulation paradigms, balancing high filler loading and fast flow capability to meet the extreme reliability and volume demands of next-generation semiconductor device packaging. Already proven in mass production environments with the latest node and currently under evaluation for next generation node flip chip packages,...

A regular podcast series where experts from the metals industry discuss innovations that improve quality, efficiency, sustainability and safety.

Looking to learn about how LOCTITE^® Wear Prevention products can help you increase equipment life, reduce unplanned downtime, and save costs? This webinar is focused on mining industry.

Special educational program covering coating solutions, lamination technologies and the practical applications for your unique production

Enabling sustainability across the metal packaging value chain

Why it’s time Eastern European manufacturers prioritized eco-friendly initiatives.

Sustainability — it really is the current buzzword that features almost everywhere you look. And so it should be, as the effects of climate change are manifesting across every corner of the globe, with frightening speed and devastation.

Enable faster production speeds with highly fluorescent adhesives for high speed inspection

As of June 1, 2022, Harima Chemicals Group, Inc. has successfully completed the acquisition of the commercial rights, assets, etc. related to the solder materials business of Henkel AG & Co. KGaA. 

Mechanical locking devices were invented to solve the common problem of loosening that happens in most threaded assemblies.