Application Challenges and Objectives

Data center switches, routers, and servers are incorporating larger, more powerful CPUs/GPUs to manage increasing data processing and bandwidth demands.

The new semiconductor packages, many containing multiple large dies, are seeing higher power concentrations, resulting in elevated operational temperatures.

At the same time, new generations of switch, router, and server designs are becoming more compact, which limits the thermal material types that are effective with very thin bond lines.

Customer Challenge

• Modern-day motor drives are integrating more complex power devices to manage growing energy efficiency requirements.  The customer’s next-generation motor controller required a thermal interface material (TIM) to manage new performance challenges and higher power densities. 
• As the IC power module is subjected to motor vibration, reliability and stability of the thermal interface material – with no material migration -- is critical to enable operational integrity.
• Any thermal material selected had to meet challenging metrics: Electrical isolation with high dielectric strength (>5000 Volts) and low thermal resistance are necessary to meet in-application conditions.

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