LOCTITE® ABLESTIK ABP 8037TI
功能与优点
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates.
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技术信息
| RT 模剪切强度 | 17.6 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 10.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 20.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 1.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 杨氏模量, @ 250.0 | 1300.0 N/mm² (188549.0 psi ) |
| 热模剪切强度 | 7.4 kg-f |
| 热膨胀系数 (CTE) | 62.0 ppm/°C |
LOCTITE® ABLESTIK ABP 8037TI
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive