LOCTITE® ECCOBOND UF 3808
Elementi i pogodnosti
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Dokumenti i preuzimanja
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Tehnički podaci
| Koeficijent toplotnog širenja (CTE), Above Tg | 171.0 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Below Tg | 55.0 ppm/°C |
| Raspored polimerizacije, @ 130.0 °C | 8.0 minuta |
| Temperatura razmekšavanja (Tg) | 113.0 °C |
| Viskoznost, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 360.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3808
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill