LOCTITE® ECCOBOND UF 3808
Features and Benefits
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 171.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 55.0 ppm/°C |
| Cure schedule, @ 130.0 °C | 8.0 min. |
| Glass transition temperature (Tg) | 113.0 °C |
| Viscosity, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 360.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 3808
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill