LOCTITE® ECCOBOND UF 3808
功能与优点
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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技术信息
| 固化时间, @ 130.0 °C | 8.0 分钟 |
| 热膨胀系数 (CTE), Above Tg | 171.0 ppm/°C |
| 热膨胀系数 (CTE), Below Tg | 55.0 ppm/°C |
| 玻璃化温度 (Tg) | 113.0 °C |
| 粘度, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 360.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3808
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill