LOCTITE® ECCOBOND UF 3808
Features and Benefits
This 1-part, reworkable liquid epoxy capillary underfill is designed to cure quickly at low temperatures, thereby minimizing stress to other components.
LOCTITE® ECCOBOND UF 3808 is a 1-part, halogen-free epoxy capillary underfill designed to cure quickly at low temperatures to minimize stress to other components. When cured, it provides excellent mechanical properties to protect solder joints during thermal cycling. It’s compatible with most Pb-free solders, and you can expect stable electrical performance even in environments with high humidity.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 171.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 55.0 ppm/°C |
| Cure schedule, @ 130.0 °C | 8.0 min. |
| Glass transition temperature (Tg) | 113.0 °C |
| Viscosity, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 360.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 3808
This 1-part, reworkable liquid epoxy capillary underfill is designed to cure quickly at low temperatures, thereby minimizing stress to other components.