LOCTITE® ECCOBOND UF 3808
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LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Tehnične informacije
| Koeficient toplotnega raztezanja (CTE), Above Tg | 171.0 ppm/°C |
| Koeficient toplotnega raztezanja (CTE), Below Tg | 55.0 ppm/°C |
| Temperatura posteklenitve (Tg) | 113.0 °C |
| Urnik strjevanja, @ 130.0 °C | 8.0 min. |
| Viskoznost, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 360.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3808
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill