LOCTITE® ECCOBOND UF 3808
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This 1-part, reworkable liquid epoxy capillary underfill is designed to cure quickly at low temperatures, thereby minimizing stress to other components.
LOCTITE® ECCOBOND UF 3808 is a 1-part, halogen-free epoxy capillary underfill designed to cure quickly at low temperatures to minimize stress to other components. When cured, it provides excellent mechanical properties to protect solder joints during thermal cycling. It’s compatible with most Pb-free solders, and you can expect stable electrical performance even in environments with high humidity.
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Información técnica
| Coeficiente de dilatación térmica (CDT), Above Tg | 171.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Below Tg | 55.0 ppm/°C |
| Programa de curado, @ 130.0 °C | 8.0 min |
| Temperatura de transición vítrea (Tg) | 113.0 °C |
| Viscosidad, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 360.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3808
This 1-part, reworkable liquid epoxy capillary underfill is designed to cure quickly at low temperatures, thereby minimizing stress to other components.