LOCTITE® ECCOBOND UF 3808
Omadused ja eelised
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Tehniline teave
| Klaasistumistemperatuur (Tg) | 113.0 °C |
| Kõvenemisaeg, @ 130.0 °C | 8.0 minut |
| Soojuspaisumise koefitsient (CTE), Above Tg | 171.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Below Tg | 55.0 ppm/°C |
| Viskoossus, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 360.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3808
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill