Henkel has developed a very low resistive ink which gives extremely good conductivity at relatively low temperatures. Learn about the ink properties and some of the applications where it can be used.

Author: Rudie Oldenzijl

Over the past decade, we have seen a significant growth in the mobile computing market which has propelled the adoption of various interconnection solutions. As further transistor scaling becomes challenging and costly, companies are turning to advanced packaging technologies in order to continue boosting performance and functionality per market demands.

Mobile technology will remain to be a key driver in the electronics industry. The trend towards smaller form factors, higher I/O count for increased density and performance, and lower cost of ownership will push alternative solutions requiring innovative materials enabling next- generation packages.

In this webinar, we will cover Henkel’s broad range of underfill solutions including Capillary Underfill (CUF), Non Conductive Paste (NCP), and Non Conductive Film (NCF). These materials were developed to support current and future flip- chip interconnect technology across different market segments. Fine pitch Cu Pillar...

In order to support the drive to flexible, printed electronics Henkel has developed a series of new, highly conductive silver inks. Main differentiator of the new inks compared to available inks is their very high electrical conductivity combined with high levels of flexibility. On the one hand, these inks open up new possibilities for printed electronic applications and on the other hand they offer the possibility to significantly reduce the total cost of ownership in existing print applications by reducing track width and/or height. Get involved now and find out more about these new, sustainable, high conductive flexible silver inks.

Author: Sharona Sente

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation.

As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level.

This webinar will cover Henkel’s latest materials, application process, test methods, and performance.

Authors: Jinu Choi, Xinpei Cao, Dan Maslyk

Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years.

Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique...