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Unsere Events und Webinare

High-Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-Level Exposed Pad Performance

This article will focus on reliability testing for conductive Die Attach Film (cDAF) technology, specifically...

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New Printed Ink Technology

Henkel has developed a very low resistive ink which gives extremely good conductivity at relatively...

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Integrated Advanced Underfill Solutions

Over the past decade, we have seen a significant growth in the mobile computing market which has propelled...

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Highly Conductive, Flexible, Silver Inks For Printed Electronics

In order to support the drive to flexible, printed electronics Henkel has developed a series of new...

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EMI Shielding Solutions for Semiconductor Packages

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic...

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Customizable Silicone Materials for MEMS and Semiconductor Packages

Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into...

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Henkel's Conductive Die Attach Film and Silver Sintering Technologies Deliver Reliable Robust Manufacturing

Technology advancement continues to push the semiconductor industry towards ever thinner and higher...

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Thermal-Clad/Isolated Metal Substrate Thermal Management System

Effective thermal management is key to ensuring consistent performance and long-term reliability of...

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Henkel Dual Cure Adhesives Enables Camera Module Success

The camera module industry is the focus of much attention, as the addition of camera features into...

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