With the trend towards sensing functionalities, the number of semiconductor-based sensors is growing fast. Such sensors often contain temperature sensitive substrates and components (like MEMS), which limit the processing of thermally-cured adhesives and encapsulants to maximum 80°C. Next to this, more accurate sensing also requires low stress and low warpage adhesives for constant and stable functionality over operating temperature range. This webinar presents new materials for MEMS, CMOS image and fingerprint sensor type assemblies fulfilling such requirements.

Author: Ing. Ruud de Wit

Webinar discussing Henkel's new test vehicle, and how it addresses miniaturization realities.

Over the last years there was already an increased interest for underfill materials noticeable in the industrial markets due to the switch from Pb-containing to Pb-free solders. The relative brittleness of the Pb-free solder isn’t coping with the high mechanical forces (vibrations and shocks), humidity requirements and CTE mismatches induced by the harsh temperatures, resulting in solder fatigue. Besides this, applications coming from other markets are finding their way to the industrial areas like for instance the “infotainment” applications and surround view cameras in cars. These aren’t used to the harsher requirements resulting in unexpected failures. Using capillary underfill will help you to deal with the CTE mismatches, humidity and other contaminants to prevent these failures. This webinar will focus on the industrial market trends and requirements and how they relate to our product portfolio and research areas.

Author: Stieven Josso

Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. With the wide variety of applications requiring thermal management, the need for alternative thermal material solutions and innovative material placement methods continues to grow. In response, Bergquist and Henkel have developed and supply a variety of highly efficient, flexible and easy to handle thermally conductive interface materials to meet current and future needs for effectively cooling electronic systems ensuring long-term reliability.

One of those materials are Polymer-based dispensable Gap Fillers with unique characteristics especially designed for ultimate thermal management design and component assembly flexibility. Thermally conductive cure-in-place liquid Gap Fillers are an alternate to classical Pads that dispense efficiently, have high thermal performance as well as can be fully automated in processing.

Author: Holger Schuh