With the trend towards sensing functionalities, the number of semiconductor-based sensors is growing fast. Such sensors often contain temperature sensitive substrates and components (like MEMS), which limit the processing of thermally-cured adhesives and encapsulants to maximum 80°C. Next to this, more accurate sensing also requires low stress and low warpage adhesives for constant and stable functionality over operating temperature range. This webinar presents new materials for MEMS, CMOS image and fingerprint sensor type assemblies fulfilling such requirements.

Author: Ing. Ruud de Wit

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation.

As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level.

This webinar will cover Henkel’s latest materials, application process, test methods, and performance.

Authors: Jinu Choi, Xinpei Cao, Dan Maslyk

Webinar discussing Henkel's new test vehicle, and how it addresses miniaturization realities.