LOCTITE® ABLESTIK ABP 2036SF
功能与优点
LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste
LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability
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技术信息
| RT 模剪切强度, 2 x 2 mm Si die on PPF leadframe | 12.0 kg-f |
| Recommended for use with | 引线框：金 |
| 主要特性 | 传导性：不导电, 固化速度：快速固化, 应力：应力 |
| 固化方式 | 热+紫外线 |
| 填料类型 | 二氧化硅 |
| 外观形态 | 膏状 |
| 导热性 | 0.35 W/mK |
| 应用 | 芯片焊接 |
| 应用方法 | 加药装置 |
| 拉伸模量, @ 250.0 °C | 55.0 N/mm² (8180.0 psi ) |
| 热模剪切强度, @ 150.0 °C 2 x 2 mm Si die on PPF leadframe | 1.6 kg-f |
| 玻璃化温度 (Tg) | 125.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 12760.0 mPa.s (cP) |
| 组分数量 | 单组份 |
| 触变指数 | 4.42 |
| 颜色 | 红 |
LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste