LOCTITE® ABLESTIK ABP 2036SF
Features and Benefits
LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste
LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability
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Technical Information
Application method | Dispense System |
Applications | Die Attach |
Color | Red |
Cure type | Heat Cure |
Filler type | Silica |
Glass transition temperature (Tg) | 125.0 °C |
Hot die shear strength, @ 150.0 °C 2 x 2 mm Si die on PPF leadframe | 1.6 kg-f |
Key characteristics | Conductivity: Electrically Non-Conductive, Cure Speed: Fast Cure, Stress: Low Stress |
Number of components | 1 Part |
Physical form | Paste |
RT die shear strength, 2 x 2 mm Si die on PPF leadframe | 12.0 kg-f |
Recommended for use with | LeadFrame: Gold |
Tensile modulus, @ 250.0 °C | 55.0 N/mm² (8180.0 psi ) |
Thermal conductivity | 0.35 W/mK |
Thixotropic index | 4.42 |
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12760.0 mPa·s (cP) |