LOCTITE® ABLESTIK DX20C
Conosciuto come ECCOBOND DX-20C 0.03KG
Caratteristiche e vantaggi
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Informazioni tecniche
| Applicazioni | Die attach |
| Caratteristiche principali | Conduttività: Elettricamente non conduttivo |
| Indice tixotropico | 4.2 |
| Resistenza al taglio matrice calda | 5.0 kg-f |
| Resistenza al taglio matrice temperatura ambiente | 12.8 kg-f |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità, cone & plate, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.