When considering which thermal management materials are the right products for the task, top-of-mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well known?

A new material system — called epoxy flux — is enabling many applications in both semiconductor packaging and printed circuit board (PCB) assembly, as well as some of the emerging device configurations such as package-on-package (POP). Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps.

New solder paste formulation technology resolves graping problems.

For applications that require extremely high-reliability, current SAC materials are less than ideal, particularly devices for end use in the automotive and military/aerospace markets. Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications, yet still be solderable at a reasonable temperature. It would need to be lead-free for high-reliability, high-temperature applications.

This paper compares the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure.

As more power is driven through active devices, the integrity of materials used to make the electrically conductive interfaces are becoming ever more critical to the performance of RF radar systems. A variety of technologies including thermal grease, solder and adhesive materials have been used to achieve this interface. In many applications, the use of conductive film adhesives are employed to take advantage of key benefits of the materials such as consistent and uniform bondline control, high electrical conductivity, and lower processing temperatures. This paper will compare the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics ...

Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market.

Microelectromechanical systems (MEMS) applications are on the rise. In fact, the MEMs market is currently outpacing overall IC market growth So why the uptick in MEMs use? Consumer and automotive markets hold the answer for now, but other market sectors such as medical are also beginning to incorporate MEMS devices.

In this technical article, a drop-in replacement for standard lead alloys that virtually eliminates tombstoning is detailed (Source: SMT).

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules.Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date. Designing much smaller packages presents its own unique hurdles, but the ability to incorporate these microscopic components into a high-volume, high-reliability production environment for assembly specialists.