LOCTITE® ABLESTIK DX20C
Poznat kao ECCOBOND DX-20C 0.03KG
Elementi i pogodnosti
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Dokumenti i preuzimanja
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Tehnički podaci
| Ključne karakteristike | Provodljivost: Električna neprovodljivost |
| Primene | Dodavanje boje |
| Sila smicanja RT kalupa | 12.8 kg-f |
| Sila smicanja vrućeg kalupa | 5.0 kg-f |
| Tiksotropni indeks | 4.2 |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Viskoznost, kugla / ploča, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.