LOCTITE® ABLESTIK DX20C

Conocido como ECCOBOND DX-20C 0.03KG

Características y Ventajas

LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Información técnica

Aplicaciones Unión
Características principales Conductividad: Conductividad No Eléctrica
Resistencia al corte a temperatura ambiente 12.8 kg-f
Resistencia al corte con calor 5.0 kg-f
Tipo de curado Curado Térmico
Viscosidad, cono & placa, @ 25.0 °C Speed 10 rpm 12000.0 mPa.s (cP)
Índice tixotrópico 4.2