LOCTITE® ABLESTIK DX20C
U svojstvu ECCOBOND DX-20C 0.03KG
Značajke i prednosti
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
Dodatne informacije
Dokumenti i preuzimanja
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Tehnički podaci
| Ključne karakteristike | Vodljivost: nije električno vodljivo |
| Primjene | Ukalupljeno |
| Snaga smicanja u kalupu RT | 12.8 kg-f |
| Snaga smicanja u vrućem kalupu | 5.0 kg-f |
| Tiksotropni indeks | 4.2 |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
| Viskoznost, stošcem i pločom, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.