LOCTITE® ABLESTIK DX20C
다른 명칭: ECCOBOND DX-20C 0.03KG
특징 및 이점
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
더 보기
기술 정보
| RT 다이 전단 강도 | 12.8 kg-f |
| 경화 방식 | 열경화 |
| 요변성 지수 | 4.2 |
| 적용 분야 | 다이 접착 |
| 점도, 원뿔 및 평판, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
| 주요 특성 | 전도성: 비 전기전도성 |
| 핫 다이 전단 강도 | 5.0 kg-f |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.