February 24, 2015 – In a major materials development breakthrough that is set to change current solder paste processing performance and cost paradigms, The Electronics Group of Henkel announces the launch of the first-ever temperature stable solder paste material. The game-changing formulation, LOCTITE GC 10, is temperature stable at 26.5°C for one year and stable at temperatures of up to 40°C for one month, which affords exceptional performance throughout the logistics and operations chain – from shipping/receiving to printing and reflow.

“Truly, this is the most exciting thing that’s happened in solder materials development in decades,” says Dr. Mark Currie, Henkel Global Product Manager for Solder Materials. “A material that has temperature stability from shipping all the way through to final assembly is a remarkable achievement."

In process, LOCTITE GC 10 offers significant improvements over conventional solder paste materials. As compared to traditional...

Henkel’s latest innovation overcomes performance and processability challenges of traditional materials.