LOCTITE® ABLESTIK DX20C
Známe ako ECCOBOND DX-20C 0.03KG
Vlastnosti a výhody
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Aplikácia | Pripevnenie formy |
| Kľúčové vlastnosti | Vodivosť: elektricky nevodivé |
| Pevnosť v strihu RT | 12.8 kg-f |
| Pevnosť v strihu za tepla | 5.0 kg-f |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Tixotropný index | 4.2 |
| Viskozita, kužeľ a doska, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.