LOCTITE® ABLESTIK DX20C
Şöyle bilinir ECCOBOND DX-20C 0.03KG
Özellikleri ve Faydaları
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
Daha fazlasını okuyun
Dokümanlar ve İndirilebilir Belgeler
Başka bir dilde bir TDS veya SDS mi arıyorsunuz?
Teknik Bilgi
| Kürlenme Türü | Isı Kürü |
| RT Kalıp Kesme Dayanımı | 12.8 kg-f |
| Sıcak Kalıp Kesme Dayanımı | 5.0 kg-f |
| Temel Özellikler | İletkenlik: Elektriği İletmeyen |
| Tiksotropik İndeks | 4.2 |
| Uygulamalar | Çip Yapıştırma |
| Viskozite, Koni ve Plaka, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.