LOCTITE® ABLESTIK DX20C
Tuntud kui ECCOBOND DX-20C 0.03KG
Omadused ja eelised
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Dokumendid ja allalaadimised
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Tehniline teave
| Kasseti viskoossus, koonus ja plaat, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
| Kuumlõike nihkejõud | 5.0 kg-f |
| Peamised omadused | Juhtivus: Elektrit mitte-juhtiv |
| RT kuumlõike nihkejõud | 12.8 kg-f |
| Rakendused | Stantskinnitus |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 4.2 |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.