LOCTITE® ABLESTIK DX20C
Conocido como ECCOBOND DX-20C 0.03KG
Características y Ventajas
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
Leer más
Documentos y Descargas
¿Quieres las Hojas de Datos Técnicos o las Fichas de Seguridad en otro idioma?
Información técnica
| Aplicaciones | Fijación de troquel |
| Características principales | Conductividad: Conductividad No Eléctrica |
| Esfuerzo de corte del dado RT | 12.8 kg-f |
| Esfuerzo de corte del dado caliente | 5.0 kg-f |
| Tipo de curado | Curado Térmico |
| Viscosidad, cono & placa, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
| Índice tixotrópico | 4.2 |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.