LOCTITE® ABLESTIK DX20C
Bekannt als ECCOBOND DX-20C 0.03KG
Merkmale und Vorteile
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Technische Informationen
| Anwendungen | Gesenk-Verbindung |
| Aushärtetechnik | Aushärtung durch Wärme |
| Haupteigenschaften | Leitfähigkeit: Elektrisch nicht leitend |
| RT Scherfestigkeit der Matrize | 12.8 kg-f |
| Thixotropie Index | 4.2 |
| Viskosität, Kegel-Platte-System, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
| Warmgesenkscherfestigkeit | 5.0 kg-f |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.