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Henkel has developed a very low resistive ink which gives extremely good conductivity at relatively low temperatures. Learn about the ink properties and some of the applications where it can be used.
Author: Rudie Oldenzijl
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Integrated Advanced Underfill Solutions
Over the past decade, we have seen a significant growth in the mobile computing market which has propelled the adoption of various interconnection solutions. As further transistor scaling becomes challenging and costly, companies are turning to advanced packaging technologies in order to continue boosting performance and functionality per market demands.
Mobile technology will remain to be a key driver in the electronics industry. The trend towards smaller form factors, higher I/O count for increased density and performance, and lower cost of ownership will push alternative solutions requiring innovative materials enabling next- generation packages.
In this webinar, we will cover Henkel’s broad range of underfill solutions including Capillary Underfill (CUF), Non Conductive Paste (NCP), and Non Conductive Film (NCF). These materials were developed to support current and future flip- chip interconnect technology across different market segments. Fine pitch Cu Pillar with...
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Highly Conductive, Flexible, Silver Inks For Printed Electronics
In order to support the drive to flexible, printed electronics Henkel has developed a series of new, highly conductive silver inks. Main differentiator of the new inks compared to available inks is their very high electrical conductivity combined with high levels of flexibility. On the one hand, these inks open up new possibilities for printed electronic applications and on the other hand they offer the possibility to significantly reduce the total cost of ownership in existing print applications by reducing track width and/or height. Get involved now and find out more about these new, sustainable, high conductive flexible silver inks.
Henkel's Conductive Die Attach Film and Silver Sintering Technologies Deliver Reliable Robust Manufacturing
Technology advancement continues to push the semiconductor industry towards ever thinner and higher functioning devices. Henkel introduces the LOCTITE ABLESTIK CDF family of products as a solution that allows robust processing of thinner, smaller, higher-density packages with reduced footprints. This ground-breaking conductive die attach film technology has been brought to the market in a pre-cut format, which enables robust manufacturing. Henkel now offers a portfolio of products which cater to consumer and automotive applications, combining an efficient process with higher reliability (MSL1 packages).
In this webinar, Dr. Gupta will cover the commercial success of products launched over the past years and also introduce participants to the latest developments in Silver Sintering Film technology as a viable Pb Free replacement. He will focus on market drivers, the motivation for developing cDAF products and their advantages in resolving manufacturing and reliability challenges...
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Thermal-Clad/Isolated Metal Substrate Thermal Management System
Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. Consumer demand for smaller, higher functioning devices presents even greater challenges for thermal management, as these conditions produce higher temperatures and more stress for electronic components. To ensure effective heat management for semiconductor devices, Henkel has developed the Thermal-Clad/Insulated Metal Substrate, which offers a highly-efficient method to cool these devices. Thermal-Clad insulated substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed circuit boards. This information will be presented during the upcoming Henkel webinar, along with details about selection of the application-specific dielectric.
Henkel will explore in this webinar what alternate solution engineers can chose and which dielectric selection is the best for the application.
Simplified New Approaches to High Thermal Die Attach Webinar
Join distinguished industry experts Jan Vardaman of TechSearch International and Davy Nakada of Henkel Corporation for a discussion about the market conditions driving a new approach to high thermal conductive die attach materials and processes.
Increases in the demand for high-performance power devices have underscored the need for better thermal control at the die level. This, combined with impending environmental legislation and the challenging processes associated with current materials, has accelerated the requirement for an easily-processed, effective die attach solution for managing the heat generated at the die level. Register now to secure your spot and improve your competitive advantage by being among those in the know.