LOCTITE® ABLESTIK DX20C
Zināms kā ECCOBOND DX-20C 0.03KG
Iezīmes un ieguvumi
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
Apraksts
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Tehniskā informācija
| Galvenie raksturlielumi | Vadītspēja: nevada elektrību |
| Karstā spiedogabīdes izturība | 5.0 kg-f |
| Pielietojumi | Spiedoga pievienošana |
| RT spiedoga bīdes izturība | 12.8 kg-f |
| Sacietināšanas veids | Sacietināšana karsējot |
| Tiksotropiskais indekss | 4.2 |
| Viscosity, konusa un plātnes mērīšanas sistēma, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.