LOCTITE® ECCOBOND FP4460
Features and Benefits
LOCTITE ECCOBOND FP4460, Epoxy, Encapsulant - glob top
LOCTITE® ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.
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Technical Information
Coefficient of thermal expansion (CTE), Below Tg | 20.0 ppm/°C |
Color | Black |
Cure schedule, @ 150.0 °C | 3.0 hr. |
Cure type | Heat cure |
Glass transition temperature (Tg) | 173.0 °C |
Operating temperature | -65.0 - 150.0 °C |
Specific gravity, @ 25.0 °C | 1.78 |
Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa·s (cP) |