LOCTITE® ABLESTIK 84-1LMISR4
功能與優點
This rigid, electrically conductive, epoxy-based die attach adhesive is perfect for small components assembly.
LOCTITE® ABLESTIK 84-1LMISR4 is one of the most widely used die-attach products in the semiconductor industry. This electrically conductive adhesive is specially formulated for use in high throughput, automated die-attach equipment. You can rely on minimum adhesive dispense and die put down dwell times, minimal tailing and stringing, and a work life up to two weeks for small series assemblies.
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技術資訊
| 使用方法 | 點膠系統 |
| 可萃取出的離子含量, 氯化物(CI-) | 20.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 10.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 10.0 ppm |
| 吸濕性, 168 hr. @ 85°C/85% RH | 0.6 % |
| 固化類型 | 熱固化 |
| 導熱性 | 2.5 W/mK |
| 建議固化方式, @ 175.0 °C | 1.0 小時 |
| 建議推廣應用 | 導線架：金, 導線架：銀 |
| 應用 | 晶片焊接 |
| 拉伸模量, @ 250.0 °C | 300.0 N/mm² (44000.0 psi ) |
| 熱膨脹係數 (CTE) | 40.0 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 150.0 ppm/°C |
| 物理形態 | 黏貼 |
| 玻璃化溫度(Tg) | 120.0 °C |
| 粘度，Brookfield CP51, @ 25.0 °C Speed 5 rpm | 8000.0 mPa.s (cP) |
| 觸變指數 | 5.6 |
| 零組件數 | 1 組分 |
| 顏色 | 銀色 |
| 體積電阻率 | ≤ 0.0002 Ohm cm |
LOCTITE® ABLESTIK 84-1LMISR4
This rigid, electrically conductive, epoxy-based die attach adhesive is perfect for small components assembly.