LOCTITE® ABLESTIK 84-1LMISR4

Features and Benefits

This rigid, electrically conductive, epoxy-based die attach adhesive is perfect for small components assembly​.
LOCTITE® ABLESTIK 84-1LMISR4 is one of the most widely used die-attach products in the semiconductor industry. This electrically conductive adhesive is specially formulated for use in high throughput, automated die-attach equipment. You can rely on minimum adhesive dispense and die put down dwell times, minimal tailing and stringing, and a work life up to two weeks for small series assemblies. 
  • Electrically conductive
  • box oven cure
  • Excellent dispensability
  • Minimal tailing or stringing
  • Long work life
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Technical Information

Application method Dispense system
Applications Die attach
Coefficient of thermal expansion (CTE) 40.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 150.0 ppm/°C
Color Silver
Cure schedule, @ 175.0 °C 1.0 hr.
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 20.0 ppm
Extractable ionic content, Potassium (K+) 10.0 ppm
Extractable ionic content, Sodium (Na+) 10.0 ppm
Glass transition temperature (Tg) 120.0 °C
Moisture absorption, 168 hr. @ 85°C/85% RH 0.6 %
Number of components 1 part
Physical form Paste
Recommended for use with LeadFrame: gold, LeadFrame: silver
Tensile modulus, @ 250.0 °C 300.0 N/mm² (44000.0 psi )
Thermal conductivity 2.5 W/mK
Thixotropic index 5.6
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 8000.0 mPa·s (cP)
Volume resistivity ≤ 0.0002 Ohm cm