LOCTITE® ABLESTIK 8700K
Vlastnosti a výhody
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Aplikácia | Pripevnenie formy |
| Farba | Biela |
| Koeficient tepelnej rozťažnosti (CTE) | 20.0 ppm/°C |
| Koeficient tepelnej rozťažnosti (CTE), Above Tg | 55.0 ppm/°C |
| Objemový odpor | 3x10¹⁴ Ohm cm |
| Pevnosť v strihu RT, 2 x 2 mm on Gold | 5000.0 kg-f |
| Plán vytvrdnutia, @ 175.0 °C | 1.0 hod. |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Tepelná vodivosť | 0.5 W/mK |
| Teplota priepustnosti skla (Tg) | 165.0 °C |
| Viskozita, @ 25.0 °C | 45000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 8700K
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.