LOCTITE® ABLESTIK 8700K
특징 및 이점
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
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기술 정보
| RT 다이 전단 강도, 2 x 2 mm on Gold | 5000.0 kg-f |
| 경화 방식 | 열경화 |
| 경화 시간, @ 175.0 °C | 1.0 시간 |
| 색상 | 흰색 |
| 열전도율 | 0.5 W/mK |
| 열팽창 계수(CTE) | 20.0 ppm/°C |
| 열팽창 계수(CTE), Above Tg | 55.0 ppm/°C |
| 유리전이온도(Tg) | 165.0 °C |
| 적용 분야 | 다이 접착 |
| 점도, @ 25.0 °C | 45000.0 mPa.s (cP) |
| 체적 저항률 | 3x10¹⁴ Ohm cm |
LOCTITE® ABLESTIK 8700K
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.