LOCTITE® ABLESTIK 8700K

Features and Benefits

This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces. 
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping. 
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 20.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 55.0 ppm/°C
Colour White
Cure schedule, @ 175.0 °C 1.0 hr.
Cure type Heat cure
Glass transition temperature (Tg) 165.0 °C
RT die shear strength, 2 x 2 mm on Gold 5000.0 kg-f
Thermal conductivity 0.5 W/mK
Viscosity, @ 25.0 °C 45000.0 mPa·s (cP)
Volume resistivity 3x10¹⁴ Ohm cm