LOCTITE® ABLESTIK 8700K
Omadused ja eelised
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
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Tehniline teave
| Klaasistumistemperatuur (Tg) | 165.0 °C |
| Kõvenemisaeg, @ 175.0 °C | 1.0 tund |
| Mahu resistiivsus | 3x10¹⁴ Ohm cm |
| RT kuumlõike nihkejõud, 2 x 2 mm on Gold | 5000.0 kg-f |
| Rakendused | Stantskinnitus |
| Soojusjuhtivus | 0.5 W/mK |
| Soojuspaisumise koefitsient (CTE) | 20.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 55.0 ppm/°C |
| Tahkumistüüp | Kuumkõvenemine |
| Viskoossus, @ 25.0 °C | 45000.0 mPa.s (cP) |
| Värvus | Valge |
LOCTITE® ABLESTIK 8700K
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.