LOCTITE® ABLESTIK 8700K
Características y Ventajas
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
Leer más
Documentos y Descargas
¿Está buscando un TDS o SDS en otro idioma?
Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 20.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Above Tg | 55.0 ppm/°C |
| Color | Blanco |
| Conductividad térmica | 0.5 W/mK |
| Programa de curado, @ 175.0 °C | 1.0 h |
| Resistencia al corte a temperatura ambiente, 2 x 2 mm on Gold | 5000.0 kg-f |
| Resistividad de volumen | 3x10¹⁴ Ohm cm |
| Temperatura de transición vítrea (Tg) | 165.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, @ 25.0 °C | 45000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 8700K
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.