LOCTITE® ABLESTIK 8700K

Elementi i pogodnosti

This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces. 
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping. 
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Dokumenti i preuzimanja

Tehnički podaci

Boja Bela
Koeficijent toplotnog širenja (CTE) 20.0 ppm/°C
Koeficijent toplotnog širenja (CTE), Above Tg 55.0 ppm/°C
Primene Dodavanje boje
Raspored polimerizacije, @ 175.0 °C 1.0 sat
Sila smicanja RT kalupa, 2 x 2 mm on Gold 5000.0 kg-f
Temperatura razmekšavanja (Tg) 165.0 °C
Tip očvršćavanja Očvršćavanje pomoću zagrevanja
Toplotna provodljivost 0.5 W/mK
Viskoznost, @ 25.0 °C 45000.0 mPa.s (cP)
Zapreminska otpornost 3x10¹⁴ Ohm cm